High-Performance Micro Rectangular Connector CDbA-66TYW-J | 1.27mm Contact Spacing

The CDbA-66TYW-J micro rectangular electrical connector is engineered for precision and reliability. With a contact spacing of 1.27mm and a row spacing of 1.1mm, it’s ideal for compact electronic designs. Its crimping cross-sectional area accommodates wire sizes from 0.05mm² to 0.15mm². Whether you’re designing for extreme temperatures or demanding environments, this connector delivers exceptional performance.

Key Features of the CDbA-66TYW-J Micro Rectangular Connector

Connector Type: The CDbA-66TYW-J is a micro rectangular electric connector designed for precision applications.
Pitch (Contact Spacing): The contact spacing (pitch) is 1.27mm, which allows for compact designs and efficient board layouts. Additionally, the row spacing is 1.1mm.
Current Rating: It can handle a current of 3 A, making it suitable for various electronic devices and systems.
Voltage Rating: The connector is pressure-resistant up to 600 V, ensuring reliable performance even in demanding environments.
Insulation Resistance: The insulation resistance is 5000 mΩ, contributing to stable signal transmission and preventing leakage.
Mechanical Life: The connector is rated for 500 cycles, indicating its durability and longevity.
Relative Humidity: It can operate at 40°C with 96% relative humidity, making it suitable for diverse conditions.
Operating Temperature Range: The minimum operating temperature is -55°C, while the maximum operating temperature is +125°C. This wide range ensures functionality across various climates.
Pressure Resistance: It can withstand a work pressure of 4.4 KPa, making it robust in different scenarios.
Vibration Resistance: The connector is designed to handle vibrations in the frequency range of 10~2000Hz at an acceleration of 196m/S².
Contact Resistance: The contact resistance is 8 mΩ, ensuring efficient electrical connectivity.
Impact Resistance: It can withstand an impact force of 490 m/s², making it suitable for rugged applications.

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