Experience Next-Level Connectivity with HUADA’s J30J-37TJ-C Micro Rectangular Connectors

Elevate your connection standards with the HUADA J30J-37TJ-C, a micro rectangular electrical connector that epitomizes high density and miniaturization. This connector boasts 37 cores within a compact frame, utilizing twisted wire twist needles for optimal contact efficiency. The precise 1.27mm contact spacing paired with a 1.1mm row spacing caters to intricate electronic configurations. Designed to accommodate wires ranging from 0.1mm² to 0.15mm², the J30J-37TJ-C meets rigorous GJB 2446 requirements and aligns with MIL-DT-83513 US military standards, ensuring high reliability in demanding environments.

Technical features of HUADA J30J-37TJ-C: Precision Engineered for High-Performance Connections

Mating Cycles (500): This indicates the connector’s durability, capable of being connected and disconnected 500 times without loss in performance.
Maximum Operating Temperature (+125 °C): The connector can operate effectively in high-temperature environments, withstanding up to +125 °C, suitable for various industrial applications.
Minimum Operating Temperature (-55 °C): It is also designed to function in extremely low temperatures, down to -55 °C, ensuring reliability in harsh conditions.
Series (Micro Rectangular Electrical Connector): This series is tailored for space-saving applications while providing high-density connections, ideal for modern electronic needs.
Current (3 A): The connector supports a current flow of 3 amperes, which is adequate for many electronic circuits and devices.
Contact Resistance (10 mΩ): A low contact resistance means that very little electrical power is lost as heat, ensuring efficient operation.
Insulation Resistance (5000 mΩ): A high insulation resistance helps to prevent electrical leakage, which can be critical for both safety and system integrity.
Vibration (10Hz~2000Hz, 196m/s²): The connector can endure significant vibration without disconnecting, making it reliable for use in vehicles, aerospace, and other dynamic environments.

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